Workshop program on Green Electronics is available - Workshop is FREE for PRIME participants
Bronze, Silver, Gold sponsorships are available.
Fulfill your goals through sponsorship: promote company awareness; promote brand image and visibility; introduce a new product; interact with research institutes and international Ph.D. students...
Company Fair offers an opportunity to connect Microelectronics employers with some
Around 135 attendees.
Welcome to the Prime 2014!
10th Conference on Ph.D Research in Microelectronics and Electronics will be held on June 30th - July 3rd 2014, in Grenoble France, capital of the French Alps. The workshop venue is the micro and nanotechnologies innovation campus (MINATEC).
PRIME conference is dedicated to Ph.D students who have to present all regular papers. All papers presented at PRIME will be published in the IEEE Xplore® giving a large audience to the event.
The purpose of PRIME is to :
o Encourage favorable exposure to Ph.D students in the early stage of their career
o Benchmark Ph.D research in a friendly and cooperative environment
o Enable sharing of Ph.D and supervisors experience on scientific research
o Create a connection between academic world and companies.
To meet these expectations PRIME2014 will feature :
o Conference program reflecting the wide spectrum of research topics in Microelectronics and Electronics, building bridges between research fields
o Free of charge full-day tutorials for all conference participants
o Company Fair for fruitful interactions between Ph.D students and their supervisors with industry representatives.
The first author/presenter of each paper must be a Ph.D student. Based on the reviewer’s evaluation top 30% of the papers will be awarded as follows :
o The GOLD LEAF Certificate for top 10% papers
o The SILVER LEAF Certificate for 10-20% papers
o The BRONZE LEAF Certificate for 20-30% paper
Areas of Interest
The following topics are of interest of the conference, but other topics within electronics field will be considered :
o Analog and Digital Signal Processing
o Computer Aided Design
o Analog, Digital, Mixed-Signal and RF IC Design
o Integrated Power ICs
o Sensor Systems and MEMS
o RF, Microwave and Millimeterwave Circuits
o VLSI and SoC Applications
o Visual Signal Processing
o Sensor Systems and MEMS
o Energy Scavenging
o Technical trends and challenges
o Electronic Skin
Paper Submission Deadline: March 17th, 2014
Notification of Acceptance: May 15th, 2014
Camera-ready submission: May 29th, 2014
Micro and nanotechnologies innovation campus